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GB300DCBBS Rack-Level SolutionGPU Server

NVIDIA GB300 NVL72 Liquid-Cooled Rack System

Model / Platform:GB300 NVL72

GB300 NVL72 is delivered as a rack, integrating 72 NVIDIA Blackwell Ultra accelerators and featuring DLC-2 direct liquid cooling. Pre-integrated and validated at the rack level before shipment, it helps customers shorten deployment cycles for large-scale AI infrastructure.

NVIDIA GB300 NVL72 Liquid-Cooled Rack System

Key Highlights

72 NVIDIA Blackwell Ultra Accelerator Cards, rack-level integration
DLC-2 Direct Liquid Cooling for Reduced Thermal Power Consumption
Factory-integrated and Rack-verified
Designed for AI Factories and Superclusters

Technical Specifications

Delivery FormatRack-scale
Accelerator72 × NVIDIA Blackwell Ultra
CoolingDLC-2 Direct Liquid Cooling
NetworkPre-integrated high-speed interconnects within racks and external networks
PowerRack-Level Power and Busbar Solutions
DeployPre-integrated at factory; quick cabinet assembly on-site

Specifications are based on public family-level information from Supermicro. Specific parameters may vary by configuration; final selection and pricing are subject to confirmation and inquiry results.

Typical Applications

Large-scale AI training clusters
AI Factory and Intelligent Computing Center
Large-scale inference service

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The product datasheet includes key features, specifications, typical application scenarios, and selection recommendations. Download it for your records or internal evaluation.

Typical Use Cases and Selection Recommendations

CombineGB300 NVL72platform positioning, common deployment scenarios, and key selection criteria to streamline requirement alignment during evaluation and quoting.

Typical Use Cases

1Large-scale AI training clustersRack-level integration of multiple accelerators for distributed training of ultra-large-scale models.
2AI Computing Center & AI FactoryDelivered by rack to enable rapid, batch-based deployment of compute resources and the formation of large-scale clusters.
3Large-scale inference servicesIdeal for inference workloads requiring high-density compute and low-latency interconnects.

Selection Recommendation

Deployment Environment

Liquid cooling integration and data center retrofitting require completing site surveys and power distribution planning in advance.

Configuration Orientation

Plan compute, power, and networking at the rack level to avoid single-server selection.

Complementary & Extensions

Requires integration with a cooling capacity distribution unit and secondary-side piping, along with planning for routine liquid cooling system operations and maintenance.

The above is a general selection reference. Specific configurations, compatibility, and pricing are subject to confirmation upon inquiry.

Compare specs for models in the same category

SelectGPU ServerCustomize comparisons for the models below. Parameters highlighted in blue differ from the current model. Export a comparison PDF for selection and record-keeping.

Ultra-Small Form Factor (USFF) Specification Comparison Sheet

Compare Models:GB300 NVL72, SYS-82 1GE-TNHR, AS-412 5GS-TNRT, ARS-11 1GL· Category:GPU Server· Generated:2026/10/26

Huaying Technology
Specification Item
Current DeviceNVIDIA GB300 NVL72 Liquid-Cooled Rack SystemGB300 NVL72
8-Card NVIDIA H200 / H100 Air-Cooled GPU ServerSYS-821GE-TNHR4U AMD EPYC GPU ServerAS-4125GS-TNRTNVIDIA GH200 Grace Hopper MGX SystemARS-111GL
Delivery FormatRack-scale———
Accelerator Card72 × NVIDIA Blackwell Ultra8 × NVIDIA H200 / H100 SXM8 × Dual-width GPU or 12 × Single-width GPU—
CoolingDLC-2 Direct Liquid CoolingAir-cooledAir-cooled—
NetworkPre-integrated high-speed interconnects within racks and external networksHigh-speed Ethernet / InfiniBand with DPU support—High-Speed Ethernet / InfiniBand
PowerRack-Level Power and Busbar Solutions———
DeployPre-integrated at factory; quick cabinet assembly on-site———
Product Form—8U Rack-Mount4U Rack1U Rack-Mounted (MGX Architecture)
Processor—Dual Intel Xeon Scalable ProcessorsDual AMD EPYC 9004 Series—
memory—DDR5, multi-channel high capacityDDR5, multi-channelHigh-bandwidth LPDDR5X and HBM
Expansion slots——PCIe 5.0 x16—
Calculation Module———NVIDIA GH200 Grace Hopper Superchip
Interconnect———NVLink-C2C High-Bandwidth Consistent Interconnect
Typical Scenarios———Scientific Computing, AI Training & Inference

Table compares only official family-level public specifications; missing items are marked with "—". Final configuration and pricing are subject to confirmation upon inquiry.

Purchase Intent

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Your information will be used solely for this selection and quotation discussion and for no other purpose.

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